TOKYO 2027 - Asia's Leading IC End Manufacturing Exhibition bringing together Advanced Equipment, Materials and Services. Assembly Equipment for IC Packaging, Packaging Materials / Equipment, Analysis / Simulation Software...
TOKYO 2027 - Asia's Leading IC End Manufacturing Exhibition bringing together Advanced Equipment, Materials and Services. Assembly Equipment for IC Packaging, Packaging Materials / Equipment, Analysis / Simulation Software...
IC & SENSOR PACKAGING EXPO JAPAN - TOKYO is an international unknown sector trade fair held in Tokyo, Japan. The next edition takes place on 17-19 February 2027.
The event focuses on the unknown sector industry, bringing together exhibitors, manufacturers, distributors and trade visitors from around the world. The fair is held yearly.
The fair is organized by RX Japan. Visit http://www.rxjapan.jp/en for detailed exhibitor and visitor information.
Click to download the details of IC & SENSOR PACKAGING EXPO JAPAN - TOKYO as PDF
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