ICPF Shenzhen 2026 — IC Packaging & Semiconductor Test Fair
Showcases advanced equipment and materials for semiconductor IC packaging and testing — die bonders, chip bonders, wire bonders, molding machines, vacuum coating and lithography. One-stop solutions for the entire packaging chain.
When and where will ICPF Shenzhen 2026 — IC Packaging & Semiconductor Test Fair take place?
Showcases advanced equipment and materials for semiconductor IC packaging and testing — die bonders, chip bonders, wire bonders, molding machines, vacuum coating and lithography. One-stop solutions for the entire packaging chain.
ICPF Shenzhen 2026 — IC Packaging & Semiconductor Test Fair is an international packaging, plastics & rubber trade fair held in Shenzhen, China. The next edition takes place on 27-29 October 2026.
The event focuses on the packaging, plastics & rubber industry, bringing together exhibitors, manufacturers, distributors and trade visitors from around the world.
The fair is organized by NEPCON Asia / RX Tradex. Visit https://www.nepconasia.com/en-gb/bandaoti/ic-pack.html for detailed exhibitor and visitor information.
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