International Packaging Machinery and Materials Packaging Fair
International Packaging Machinery and Materials Packaging Fair
Tokyo Pack is an international packaging, plastics & rubber machinery & technologies trade fair held in Tokyo, Japan. The next edition takes place on 14-16 October 2026.
The event focuses on the packaging, plastics & rubber machinery & technologies industry, bringing together exhibitors, manufacturers, distributors and trade visitors from around the world. The fair is held biennial.
The fair is organized by Japan Packaging Institute.
Click to download the details of Tokyo Pack as PDF

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